Assess a soldered harness termination against the complementary requirements of ECSS-Q-ST-20-30C section 7.3, which sit on top of the IPC soldered-termination and crimp acceptance criteria. Use when the task is grading the additions a solder joint owes: alloy lead content and the whisker mitigation plan a near pure tin alloy needs, flux activation and the cleaning it obliges, iron tip temperature inside its window, a dwell and reheat budget scaled to conductor cross-section, the insulation cl...
Scanned 9/27/2026
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---
name: q2030-comp-soldering
description: "Assess a soldered harness termination against the complementary requirements of ECSS-Q-ST-20-30C section 7.3, which sit on top of the IPC soldered-termination and crimp acceptance criteria. Use when the task is grading the additions a solder joint owes: alloy lead content and the whisker mitigation plan a near pure tin alloy needs, flux activation and the cleaning it obliges, iron tip temperature inside its window, a dwell and reheat budget scaled to conductor cross-section, the insulation clearance window at the termination, wetting angle acceptance, owed inspection magnification and operator certification currency. Trigger: ecss, q-st-20-30c, complementary-soldering-delta, solder-alloy-tin-whisker, solder-thermal-exposure-budget, solder-insulation-clearance-window, solder-wetting-angle, operator-certification-currency."
license: Apache-2.0
compliance: STANDARDS-REF
standards:
- id: ecss
reference-only: true
gated: false
domain: space-systems
pack: space-systems
compatibility: "agentskills.io SKILL.md; any SKILL.md host (Claude Code, Hermes, OpenClaw)"
metadata:
domain: space-systems
subdomain: ecss
tags: [ecss, q-st-20-30-harness-scope, q2030-comp-soldering, complementary-soldering-delta, solder-alloy-tin-whisker, solder-thermal-exposure-budget, solder-insulation-clearance-window, solder-wetting-angle]
version: 0.1.0
author: Aero Agent Skills
---
# ECSS Harness Manufacturing — Complementary Soldering (space-systems/ecss/q2030-comp-soldering)
Use when the task is the complementary soldering provision of
ECSS-Q-ST-20-30C section 7.3 — the requirements the standard adds on
top of the soldered-termination and crimp acceptance criteria of its
external basis, covering what the joint is made of, how it was heated,
where the insulation ends, and who inspected it with what.
## Domain quick reference
- The alloy is a reliability input, not a shop preference. A solder
with too little lead behaves as near pure tin and grows whiskers in
vacuum over years, which is a short-circuit mechanism no visual
acceptance criterion catches. It is admissible only behind a declared
mitigation plan, and the plan is the evidence, not the intention.
- Flux is graded by what it leaves behind. A non-activated or mildly
activated residue is admissible as it sits; an activated or
water-soluble residue is corrosive or conductive and obliges a
cleaning step, so an uncleaned joint made with one is a finding
however good the fillet looks.
- Heat is a budget, and reheats spend from it. The dwell a joint can
take scales with conductor cross-section because a heavier conductor
needs longer to reach temperature; every heat application spends
another dwell, so the exposure that matters is dwell times the number
of applications. The tip temperature has a window at both ends: too
cold gives a joint that never wetted, too hot damages the insulation
and anneals the conductor.
- The insulation end sits in a window, not at a target. Too close and
the insulation is heat-damaged and the joint cannot be seen; too far
and bare conductor is exposed to handling and to its neighbours.
- Wetting angle is the measurement that says whether solder joined the
conductor. A joint can be full, bright and well-shaped and still show
an angle that says the solder sat on the surface rather than wetting
it.
- Inspection magnification is owed by the conductor, not chosen by the
inspector, and an operator certification that has lapsed makes the
workmanship record incomplete whatever the joint looks like.
## Workflow
1. Validate the termination record: identifier, alloy composition, flux
type and cleaning, conductor cross-section, insulation diameter and
clearance, tip temperature, dwell, reheats, wetting angle,
inspection magnification and certification age. A composition that
sums above a hundred percent, a non-positive cross-section or
diameter, or a fractional reheat count is an input error, not a case
to normalize away.
2. Grade the alloy: below the lead floor the joint needs a declared
whisker mitigation plan.
3. Grade the flux: an activated or water-soluble flux with no cleaning
step recorded is a finding.
4. Compute the allowable dwell and the thermal budget from the
cross-section, compare the spent exposure against the budget, and
check the tip temperature against both ends of its window and the
heat applications against their allowance.
5. Compute the insulation clearance window from the insulation diameter
and place the as-built clearance inside it.
6. Grade the wetting angle against its acceptance value.
7. Derive the owed inspection magnification from the cross-section,
check the certification currency, then aggregate the lot with a
count per finding type, absorbing representation error at each limit
with a named tolerance rather than by widening it.
## Pitfalls
- Accepting a near pure tin alloy because the joint passes the visual
criteria. Whiskers grow after acceptance, which is exactly why the
mitigation plan is the requirement rather than the inspection.
- Reading flux type alone. The finding is the residue, so the flux type
and the cleaning record have to be read together.
- Budgeting heat per application instead of per joint. Two touch-ups
each inside the dwell limit can still take the termination past the
exposure the conductor and insulation can survive.
- Treating the insulation clearance as a minimum only. The window has
an upper edge, and exposed conductor beyond it is its own defect.
- Letting the inspector pick the magnification. A fine conductor needs
more than a coarse one, and a joint examined below the owed
magnification has not been examined to the criteria it was graded
against.
## Behavior contract (gate 3)
The termination validation, alloy and flux grading, scaled dwell and
thermal-exposure budget, tip-temperature window and heat-application
allowance, insulation clearance window, wetting-angle acceptance, owed
inspection magnification, certification currency and lot aggregation
are exercised by the gate 3 contract test:
scripts/test_q2030_comp_soldering.py against
scripts/q2030_comp_soldering_logic.py (stdlib unittest, offline). Run:
python3 scripts/test_q2030_comp_soldering.py
## Compliance
- ECSS standards are freely downloadable (ESA); cite the source and
paraphrase per standards-map.yaml.
- compliance: STANDARDS-REF, gated: false.
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